Tessolve Semiconductor, a venture of Hero Electronix, has raised $75 million in a funding round led by Vector Line Capital as it looks to strengthen its semiconductor engineering capabilities, expand its service portfolio and accelerate international growth.
The fresh capital will primarily support strategic acquisitions that complement Tessolve’s existing operations and help the company broaden its presence across the semiconductor value chain. The company is already in advanced discussions to complete multiple acquisitions over the next few quarters.
The funding round also saw participation from existing investors TPG and Novo Tellus Capital Partners.
Expanding Semiconductor Engineering Capabilities
Founded in 2004, Tessolve provides end-to-end semiconductor engineering services, covering chip architecture, design, validation, testing and embedded systems. Its offerings support companies throughout the chip development process, from initial design to testing and product development.
The company is also expanding its work in artificial intelligence (AI) and high-performance computing (HPC) chips, supported by its in-house semiconductor platforms, engineering expertise and global laboratory infrastructure.
With semiconductor technologies becoming increasingly complex, demand for specialised chip design, verification and testing services is creating opportunities for engineering companies to expand their capabilities and serve a broader range of customers.
Tessolve works with 18 of the world’s top 20 semiconductor companies and has built a presence across international markets.
Acquisitions to Drive the Next Phase of Growth
Tessolve plans to use the latest funding to pursue acquisitions that strengthen its existing expertise, introduce complementary capabilities and expand its global footprint.
The company has previously expanded through acquisitions, including its purchase of Germany-based Dream Chip Technologies GmbH in November 2024 for approximately ₹400 crore. The acquisition added to its chip design capabilities and international operations.
The latest investment builds on a $150 million funding round raised from TPG in 2025, taking Tessolve’s cumulative funding to approximately $265 million.
Strengthening India’s Semiconductor Ecosystem
Tessolve’s fundraising comes as India continues to develop its semiconductor design, engineering and manufacturing ecosystem. The growing adoption of AI, high-performance computing and advanced electronics is increasing the need for specialised engineering expertise and reliable chip development services.
By investing in acquisitions, expanding its technical capabilities and strengthening its international presence, Tessolve is positioning itself to serve the evolving requirements of semiconductor companies worldwide.
The latest funding marks another step in the company’s expansion strategy, with a focus on building a broader engineering portfolio and supporting the next generation of semiconductor technologies.
